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    Intelligent and connected embedded system-on-module based on the NXP i.MX6 UL, with turnkey Linux software support in a stamp-sized form factor

    The Digi ConnectCore® 6UL module delivers a secure and extremely cost-effective connected System-on-Module platform that is slightly bigger than a postage stamp.

    Its patent-pending Digi SMTplus® surface mount form factor allows you to choose simplified design integration leveraging proven and easy-to-use edge-castellated SMT technology, or a versatile LGA option for ultimate design flexibility with access to virtually all interfaces.

    Built on the NXP® i.MX6UL application processor, the module is the intelligent communication engine for today’s secure connected devices. It seamlessly integrates dual-Ethernet and pre-certified dual-band Wi-Fi (802.11a/b/g/n/ac) with Bluetooth® 5 connectivity.

    Embedded device security is a critical design aspect for the growing number of connected applications (“IoT”) and the ConnectCore 6UL removes the implementation barriers by providing you with Digi TrustFence®, a fully integrated secure module platform with complete Linux® software support.

    Diagram MFG_CC-WMX-JN58-NE.jpg (152 KB)

    – Stamp-sized, secure, connected System-on-Module platform
    – NXP i.MX6UL-2, Cortex®-A7 at 528 MHz
    – Up to 1 GB NAND flash, up to 1 GB DDR3
    – Patent-pending low-profile Digi SMTplus form factor
    – Integrated Digi Microcontroller Assist™ for 2.5 μA ultra-low power modes
    – Pre-certified 802.11a/b/g/n/ac + Bluetooth 5 option
    – Integrated dual 10/100 Ethernet connectivity
    – Digi TrustFence embedded device security framework
    – Remote management with Digi ConnectCore® Cloud Services
    – Digi Embedded Yocto Linux® support
    – Turnkey development available from Digi WDS



    APPLICATION PROCESSOR : NXP® i.MX6UL-2, ARM® Cortex®-A7 at 528 MHz, 128 KB L2 cache, with NEON™ MPE (Media Processor Engine) co-processor and programmable smart DMA (SDMA) controller

    MEMORY : 256 MB / 512 MB / 1 GB NAND flash, 256 MB / 512 MB / 1 GB DDR3

    PMIC : NXP® PF3000

    VIDEO/GRAPHICS : 2D Pixel Processing Pipeline (PXP) for color-space conversion, scaling, alpha-blending, and rotation, 8-/16-/18-/24-bit parallel LCD Display up to WXGA (1366x768), 8- /10- /16- /24-bit Parallel CSI with BT.656 support

    SECURITY : Dedicated cryptographic co-processor (Secure Element) with hardware assisted Eliptic Curve support: FIPS 186-4 Elliptic Curve Digital Signature (ECDSA), NIST SP800-56A Elliptic Curve Diffie-Hellman (ECDH), NIST Standard P256 Elliptic Curve, 256-bit SHA/HMAC, X.509 certificate support, Multilevel RNG (NIST SP 800-90A DRBG), Tamper Monitor, 72-bit unique device ID, i.MX6UL Cryptographic Acceleration and Assurance Module (CAAM): AES 128/256, DES/3DES, ARC4, RSA (4096), MD5, SHA-1/224/256, HMAC, AES-CMAC, AESXCBC- MAC, AES-CCM, TRNG with hardware entropy source (NIST SP-800-90A), Digi TrustFence® Embedded Security Framework

    PERIPHERALS/INTERFACES : 1 x dedicated MMC 4.5/SD 3.0/SDIO Port (1-/2-4-bit), 2 x USB 2.0 OTG with PHY, 3x I2S/SAI, 1 x S/PDIF Tx/Rx, 2 x FlexCAN (2.0b), 4 x I2C, 4 x SPI, 7 x UART, 4 x Timer, 8 x PWM, 3 x Watchdog, 2 x 12-bit ADC (10 channels) with 4-wire/5-wire touch controller, up to 103 GPIOs

    EXTERNAL BUS : 16-bit address / up to 16-bit data (multiplexed and non-multiplexed modes)

    ETHERNET : Dual 10/100 Mbit Ethernet MAC + IEEE 1588

    WIRELESS : Wi-Fi 5 802.11a/b/g/n/ac 1x1 (MCS 0-9), Bluetooth® 5 with strong WPA2-Enterprise authentication/encryption for Wi-Fi connections

    MCA™ MICROCONTROLLER ASSIST : Ultra-low power ARM® Cortex®-M0+, up to 48 MHz (NXP Kinetis KL03: KL03P24M48SF0)

    OPERATING TEMPERATURE : Industrial: -40 °C to 85 °C (-40 °F to 185 °F); depending on use case and enclosure/system design

    STORAGE TEMPERATURE : -50 °C to 125 °C (-58 °F to 257 °F)

    RELATIVE HUMIDITY : Relative humidity 5% to 90% (non-condensing)

    RADIO APPROVALS*** : US, Canada, EU, Japan, Australia/New Zealand, Brazil

    EMISSIONS / IMMUNITY / SAFETY : FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES-003 Class B, VCCI Class II, AS 3548, FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024, EN 301 489-3, Safety UL/UR (or equivalent)

    DESIGN VERIFICATION : Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78; vibration/shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT

    MOUNTING* / PIN COUNT : Common Digi SMTplus® surface mount footprint using 76-pad edge castellated pads (1.27 mm pitch) or 245-pad LGA (1.27 mm pitch) option

    MECHANICAL DIMENSIONS : 29 mm x 29 mm x 3.5 mm (1.14 in x 1.14 in x 0.14 in)

    POWER CONSUMPTION : Idle Mode (Linux® up, no networking): 100 mA at 5 V -- Idle Mode (Linux® up, with 25% Wi-Fi transmit): 118 mA at 5 V -- Standby Mode (with memory refresh): 6 mA at 5 V

    ULTRA LOW-POWER MODES : Event Trigger Mode: 2.5 μA at 3 V (i.MX6UL off, MCA LLS w/HS Comparator active)** Scheduled Wake-Up Mode: 25 μA at 3 V (i.MX6UL off, MCA LLS w/HS Comparator active)**


    OPERATING FREQUENCY BAND : 2402 - 2480 MHz; 5.250 - 5.350 GHz; 5.470 - 5.725 GHz


    More information : https://www.digi.com/resources/library/data-sheets/ds-connectcore6-ul?view=fullscreen

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