BGA-Bottom-327 ( Ord. No. : 70-3110 ) + BGA-Top-284 ZIF (a) ( Ord. No. : 70-2635A ) soket seti

Name: BGA-Bottom-327 ( Ord. No. : 70-3110 ) + BGA-Top-284 ZIF (a) ( Ord. No. : 70-2635A ) soket seti
Brand: Elnec
SKU: T1003
Price: 918.00 USD
Availability: OutOfStock

Ürün Kodu: T1003

765,00 USD + KDV

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BGA-Bottom-327
(Ord. no. 70-3110)

bottom board of BGA adapters, assigned for eMMC devices (e.g. THGBMBG7D2KBAIL, KLM4G1FEAC-B031000) in matrix 14x14-8x8, 6x6-4x4 supported from PG4UW software version 3.07z09 made in Slovakia
Ord. no.	70-3110
Connection to BGA-Top-X	4x25 sockets for wire wrap pin
Bottom	2x24 pins, square, 0.6x0.6mm, rows spacing 600mil
Class	BGA/LGA
Subclass	BGA-Bottom
Availability in stock	34 pcs. [other 75 pcs. within 3 days]

Adapter manual

Protect the contacts of adapter connectors from contamination. Any dirt and/or fat on contacts may cause errors during programming.

For work with BGA device it is necessary put together BGA-Bottom-X with some BGA-Top-X board according to the information provided by PG4UW software.

Operating conditions: temperature 5°C ÷ 40°C (41°F ÷ 104°F), humidity 20% ÷ 80% non-condensing.

BGA-Top-284 ZIF (a)
(Ord. no. 70-2635A)

special adapter, assigned for eMMC devices in BGA package designed for TurboMode ZIF socket accepts many variations of BGA packages, that differ in ball diameter, ball height and body thickness. The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board. operating (mechanical) warranty of ZIF socket - 10,000 actuations made in Slovakia
Ord. no.	70-2635A
Socket	ZIF BGA153, OpenTop type
Connection to BGA-Bottom-X	4x25 pins, square, 0.6x0.6mm
Class	BGA/LGA
Subclass	BGA-Top
Availability in stock	15 pcs. [other 40 pcs. within 3 days]

Adapter manual

For work with BGA device it is necessary put together BGA-Top-284 ZIF (a) with some BGA-Bottom-X board according to the information provided by PG4UW software.
The top cover must be fully actuated (depressed) before inserting a package into the socket. If the chip is inserted into only partially opened ZIF socket, then - after releasing of top - the tweezer contact might bend and if more times done by this way also tweezer contact can be broken.
Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
The picture show, how to put together the BGA-Top-X ZIF-CS and BGA-Bottom-X boards to have complete BGA adapter.
Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.

See this brochure for details on proper package loading procedure