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DIL48/BGA100-1.01 ZIF eMMC-2 Adaptör Soketi

Elnec
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585,00 USD + KDV
KDV Dahil
:
690,30 USD
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:
690,30 USD
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  • DIL48/BGA100-1.01 ZIF eMMC-2
    (Ord. no. 70-3347)


    • specialized adapter for eMMC devices in BGA100 package
    • designed for TurboMode
    • used ZIF socket accepts many variants of supported package, different in ball diameter, ball high and/or body thickness, see section Accepted package(s)
    • operating (mechanical) life of ZIF socket – 10,000 actuations
    • supported from PG4UW software version 3.12k
    • made in Slovakia
    Ord. no.70-3347
    SocketZIF BGA100, OpenTop type
    Bottom2x24 pins, square, 0.6x0.6mm, rows spacing 600mil
    ClassSpecialized
    SubclassMemory (NOR/NAND/eMMC)
    Availability in stock3 pcs. [other 7 pcs. within 3 days]
    Adapter manual
    • Protect the contacts of adapter connectors and ZIF socket from contamination. Any dirt and/or fat on contacts may cause errors during programming.
    • Usage of vacuum pick-up tool is expected for device handling.
    • Proceed with care! Incorrect insertion of adapter in programmer ZIF socket or device in adapter ZIF socket may lead to programmed device damage.

    • Insert adapter into programmer ZIF socket. If you are in doubts about orientation of the adapter in programmer ZIF socket, there is a rule of thumb - orientation of adapter name text is the same as orientation of the text on the top of programmer.
    • Visually check the placement of adapter in programmer ZIF socket.
    • Push the cover of adapter ZIF socket (the topmost movable part) to open the socket. Once fully actuated, drop the device into the socket from a height of 2 to 3mm above the seating plane. For correct device orientation, follow the instructions shown on picture in PG4UW software Device info window for device being programmed. Then release adapter ZIF socket.
    • The cover must be fully actuated (depressed) before inserting a device into the socket.
    • Do not press on device while inserting it and/or releasing the cover.
    • Visually check the placement of programmed device in adapter ZIF socket. If everything looks OK, the device is ready for programming.
    • To take out the device from adapter, push the cover of adapter ZIF socket and remove the device.
    • When you finish the work with adapter, remove it from programmer ZIF socket.

    • Operating conditions: temperature 5°C ÷ 40°C (41°F ÷ 104°F), humidity 20% ÷ 80% non-condensing.

     
    Accepted package(s)
    BGA packagePackage
    Design
    NAMESYMBOLMINNOMMAX
    ProfileA--1.4
    Ball HeightA10.25--
    Body ThicknessA20.911.011.11
    Ball Diameterb-0.45-
    Body SizeD17.91818.1
    Body SizeE13.91414.1
    Ball Pitche-1-
    Ball Array DGD-17-
    Ball Array EGE-10-
    NAMESYMBOLMINNOMMAX
    ProfileA--1.4
    Ball HeightA10.25--
    Body ThicknessA2-0.95-
    Ball Diameterb0.40.450.5
    Body SizeD17.91818.1
    Body SizeE13.91414.1
    Ball Pitche-1-
    Ball Array DGD-17-
    Ball Array EGE-10-
    NAMESYMBOLMINNOMMAX
    ProfileA1.21.31.4
    Ball HeightA10.25--
    Body ThicknessA2---
    Ball Diameterb0.40.450.5
    Body SizeD17.91818.1
    Body SizeE13.91414.1
    Ball Pitche-1-
    Ball Array DGD-17-
    Ball Array EGE-10-
    NAMESYMBOLMINNOMMAX
    ProfileA--1.4
    Ball HeightA10.25--
    Body ThicknessA20.931.031.13
    Ball Diameterb-0.45-
    Body SizeD17.91818.1
    Body SizeE13.91414.1
    Ball Pitche-1-
    Ball Array DGD-17-
    Ball Array EGE-10-

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